IBM to Design Self-Destructing Microchips For DARPA
IBM will develop microchip technology that is designed to use a self-destruct mechanism under a $3.5 million contract awarded by the Defense Advanced Research Projects Agency. The company will explore methods for remotely shattering CMOS-based military electronics into powder once the items are discarded, DARPA said Friday in a FedBizOpps notice. DARPA says IBM intends to use strained […] More